How technology providers can address data centre cooling challenges

Heat dissipation for high power density is an industry-wide challenge necessitating innovative technologies to disperse heat more effectively in data centres.

Advanced computational fluid dynamics (CFD) software is increasingly deployed to carry out simulations to predict the air speed and temperature field of UPS components, boards, and systems to deliver an optimal heat dissipation solution.

This creates an ideal model for module layout, air channel design, fan selection, guiding printed circuit board (PCB) and structure design. Furthermore, such a simulation platform is also efficient and generates optimal results because it does not include processes necessary for traditional thermal design, such as manual estimation, verification, modification, and re-verification.

Such a multi-physical-field simulation platform can deliver a precision level that is 30 per cent higher than traditional models.

Temperature increase simulation for rectifiers and inverters is conducted in three fields: electromagnetic (electromagnetic compatibility and signal integrity), temperature (air volume, air speed, and temperature rise), and stress field (electrical and mechanical). Powerful computing based on the simulation achieves the optimal layout of auxiliary systems and modules under various constraints. In addition, high-precision mockup and simulation facilitate a refined heat dissipation design. At the same time, internal modeling of components (chips and semiconductors) supports precise thermal flow density design for internal crystal elements of insulated gate bipolar transistors (IGBTs).

Based on the simulation results, engineers then create advanced design and layout of systems and components that maximise heat dissipation capability.

Advances in the data centre cooling design have resulted in a U-shaped symmetric architecture. The U-shaped symmetric architecture features small air resistance and fast heat dissipation. In addition, extended ventilation channels have made it possible to achieve wide-range heat dissipation. Furthermore, closely coupled cooling eliminates hotspot concentrations.

Due to the enhanced heat dissipation design, such systems can function at 40 degree celsius for extended periods without derating.

While innovative components further improve the heat dissipation capability, corrugations on the heat sink enhance the convective heat transfer coefficient, improving heat dissipation by as much as 10 per cent.

Inductors with vertical windings significantly improve winding heat dissipation further. In addition, proper matching between fans and air channels as well as a refined air volume control together considerably improve the heat dissipation efficiency of fans.

Extensive temperature sampling and data computing are now leveraged in the industry to control heat dissipation at all possible points. All components are tested under all working conditions. In addition, the IGBTs, inductors, diodes, and bus capacitors support a large temperature margin.

Such power supply and distribution systems leave more space for data centre cabinets, enabling customers to increase revenue.

Advances in UPS systems highlight how technical innovation in data centre cooling can deliver better customer experience while promoting business success.

Jake Guo is the Data Centre Solutions manager at Huawei ME